Global footprint Nepes operates across multiple regions with manufacturing sites in South Korea, Philippines and China and sales offices in San Diego, Shanghai and Taiwan, signaling potential for regional supply chain partnerships and multiregional contracts.

PoP development Recent work on Package on Package technology with mass production target in H2 2025 suggests opportunities to position Nepes for customers pursuing advanced heterogeneous integration and high-density packaging solutions.

Turnkey back-end End-to-end IC back-end services for 8 and 12 inch wafers including wafer bumping, packaging and testing offer a single sourcing option for fabless and IDM partners seeking simplified supply chains and faster time to market.

Diverse packaging Portfolio spans Wafer Level Package, System in Package and Fan-out Panel Level Package, enabling Nepes to tailor packaging solutions across different product classes and performance requirements for various customers.

Financial scale Estimated revenue in the mid-range of hundreds of millions with a mid-sized employee base, indicating a solid platform for expanding existing programs and upsell into higher-value packaging and testing services as customers scale.