PoP Opportunity Nepes is actively developing Package on Package PoP technology with mass production planned for H2 2025, presenting a potential sales window for advanced interconnect and packaging solutions, tooling, test services, and upgrade opportunities for customers adopting PoP-enabled designs.

Global Footprint With manufacturing sites in Korea, the Philippines, and China and sales offices in San Diego, Shanghai, and Taiwan, Nepes offers regional proximity for APAC and North American customers, enabling localized support, logistics optimization, and collaborative R&D engagements.

End-to-End Nepes provides turn-key back-end services for 8″ and 12″ wafers including wafer bumping, packaging, and testing across WLP, SiP, and FOPLP, presenting cross-selling opportunities for vendors of front-end ICs, test equipment, materials, and EMS services seeking integrated supply chain solutions.

Midmarket Focus With a revenue range of $50M–$100M and a mid-sized employee base, Nepes sits between large incumbents and smaller peers, suggesting open deals for scalable packaging capacity, process enhancements, and co-development programs tailored to fabless and IDM customers seeking flexible partnerships.

Sustainability & Expansion Past expansion plans into multiple regions and LED/semiconductor facilities indicate a growth-oriented strategy that can be aligned with customers pursuing regional supply resilience, technology collaborations, and sustainability-driven packaging options to differentiate offerings.