Unique value Vertical Probe Cards (VCT) enable simultaneous probing of multiple dies and claim higher yield than cantilever epoxy cards, presenting a compelling efficiency and profitability story for test floors with capacity constraints.

High frequency capability ICT reports successful testing up to approximately 10 GHz, suggesting relevance for customers with high-frequency signal integrity requirements and advanced RF/mixed-signal applications.

Small company agility With a lean team and sub-$1M revenue, ICT can offer flexible engagement, quick pilots, and customized solutions, appealing to mid-market semiconductor fabs or test houses seeking targeted, faster ROI deployments.

Growth potential A niche yet scalable technology positioned to address pad and bump output structures across various die architectures, offering cross-portfolio expansion opportunities as customers expand test coverage.

Competitive positioning Benchmarking against larger players, ICT’s VCT approach can differentiate on multi-die probing efficiency and yield improvements, presenting a value-based upsell to existing probe card and test floor vendors.