Insights

Specialized wafer work Target manufacturers requiring complex wafer dicing and grinding, including MEMS and life sciences, who need reliable NPI through high-volume production support and stringent cleanliness/quality controls.

Military readiness Leverage their stated capability to support military applications with strict specs and continuity from NPI to commercial scale; position as a vetted supplier for defense contractors seeking trusted surface preparation and dicing services.

Quality and certification Emphasize ISO 9001:2008 registered quality management and robust static/cleanliness controls to win projects with demanding specification requirements from fab, fabless, and contract manufacturers.

Growth through niche bets Promote expansion opportunities in high-value segments such as SiC, advanced materials, and 300mm wafer processing, where precision dicing/grinding can differentiate offerings for premium customers.

Digital and outreach Capitalize on existing digital footprint and lead generation channels (Google Ads, Analytics) to target semiconductor, MEMS, and life sciences verticals with tailored messaging and case studies demonstrating end-to-end support from prototyping to production.

Grinding and Dicing Services Inc Tech Stack

Grinding and Dicing Services Inc uses 8 technology products and services including Google Ads, Google Ads Conversion Tracking, WordPress, and more. Explore Grinding and Dicing Services Inc's tech stack below.

Google Ads

Advertising

Google Ads Conversion Tracking

Analytics

WordPress

Content Management System

Floating UI

Javascript Libraries

PHP

Programming Languages

reCAPTCHA

Security

Google Analytics

Web Analytics

Apache

Web Servers

Grinding and Dicing Services Inc Email Formats	Example	Percentage
FLast@wafergrind.com	JDoe@wafergrind.com	75%
Last@wafergrind.com	Doe@wafergrind.com	25%
FLast@dieprepservices.com	JDoe@dieprepservices.com	100%

Grinding and Dicing Services Inc Email Formats

Example

Percentage

FLast@wafergrind.com

JDoe@wafergrind.com

75%

Last@wafergrind.com

Doe@wafergrind.com

25%

FLast@dieprepservices.com

JDoe@dieprepservices.com

100%

Frequently Asked Questions

What is Grinding and Dicing Services Inc's phone number?

You can contact Grinding and Dicing Services Inc's main corporate office by phone at

+1-408-451-****

. For more prospecting data, LeadIQ has access to up-to-date and accurate contact information within our platform. Find, capture, and sync contact data to your CRM and sales tools in one click.

What is Grinding and Dicing Services Inc's official website and social media links?

Grinding and Dicing Services Inc's official website is dieprepservices.com and has social profiles on LinkedIn.

How much revenue does Grinding and Dicing Services Inc generate?

As of July 2026, Grinding and Dicing Services Inc's annual revenue is estimated to be <$1M.

What is Grinding and Dicing Services Inc's NAICS code?

Grinding and Dicing Services Inc's NAICS code is 3344 - Semiconductor and Other Electronic Component Manufacturing.

How many employees does Grinding and Dicing Services Inc have currently?

As of July 2026, Grinding and Dicing Services Inc has approximately 5 employees across 1 continents, including North America. Key team members include Senior Sales Engineer: R. B.. Explore Grinding and Dicing Services Inc's employee directory with LeadIQ.

What industry does Grinding and Dicing Services Inc belong to?

Grinding and Dicing Services Inc operates in the Semiconductor Manufacturing industry.

What technology does Grinding and Dicing Services Inc use?

Grinding and Dicing Services Inc's tech stack includes Google AdsGoogle Ads Conversion TrackingWordPressFloating UIPHPreCAPTCHAGoogle AnalyticsApache.

What is Grinding and Dicing Services Inc's email format?

Grinding and Dicing Services Inc's email format typically follows the pattern of FLast@wafergrind.com. Find more Grinding and Dicing Services Inc email formats with LeadIQ.

When was Grinding and Dicing Services Inc founded?

Grinding and Dicing Services Inc was founded in 1992.

Grinding and Dicing Services Inc

Q: How many employees does Grinding and Dicing Services Inc have currently?

Grinding and Dicing Services Inc has approximately 5 employees.

Q: What industry does Grinding and Dicing Services Inc belong to?

Grinding and Dicing Services Inc operates in the Semiconductor Manufacturing industry.

Q: What technology does Grinding and Dicing Services Inc use?

Grinding and Dicing Services Inc's tech stack includes gstatic.com, jQuery, jQuery Migrate, Really Simple Discovery, GoDaddy.

Q: When was Grinding and Dicing Services Inc founded?

Grinding and Dicing Services Inc was founded in 1992.

Q: What is Grinding and Dicing Services Inc's NAICS code?

Grinding and Dicing Services Inc's NAICS code is 3344 (Semiconductor and Other Electronic Component Manufacturing).

Semiconductor ManufacturingCalifornia, United States2-10 Employees

The company operates in the semiconductor manufacturing sector, offering wafer dicing, grinding, thinning, polishing, inspection, and related processing services. It is based at 925 Berryessa Road in San Jose, California, United States, and employs a small team of 2 to 10 people. Serving diverse market segments including semiconductor, MEMS, and life sciences, it provides continuity of support from NPI to commercial-scale manufacturing for both commercial and military applications. The organization maintains robust static and cleanliness controls and is ISO 9001:2008 certified. Its capabilities include stealth laser dicing, wafer dicing, grinding, thinning, polishing, inspection, wafer saw, 300 mm processing, die bonding, and work with materials such as SiC, glass, and silicon; it has supported fab and fabless customers for more than 20 years.

Insights

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