BGA Test and Technology Email Format
Defense and Space ManufacturingNew York, United States11-50 Employees
BGA Test and Technology specializes in tin whisker mitigation for high-reliability electronics used in aerospace, defense, and industrial devices. Based in Holbrook, New York, the company operates as a small to mid-sized producer that employs six-axis robotic cells and carries process approvals from major defense primes. Since 2010, it has provided RHSD and Re-Balling services, prioritizing inventory management to reduce additional touch costs for OEMs and contract manufacturers. The firm's service portfolio includes Re-Balling, Robotic Hot Solder Dip, Robotic Gold Embrittlement Mitigation, and bonded warehouse and kitting. It maintains AS9100D and ISO 9001:2015 certifications, an ESD-certified production floor, and ITAR registration (Cage Code 6EMC9), with manufacturing standards aligned to GEIA-STD-0006 and IEC/TS 62647-4.