Space-grade SiP 3D PLUS specializes in stacking heterogeneous devices into ultra-miniaturized SiP modules for space. With over 25 years of flight heritage and more than 220,000 components in space, they provide a trusted, high-reliability option for satellite OEMs and government missions seeking compact, rugged electronics.

Broad Product Suite Their product range covers memory, computer cores, interfaces, power solutions, protection ICs, camera heads/systems, and custom SiP solutions. This breadth supports multi-domain system integrations across space, avionics, defense, security, telecoms, and industrial sectors, enabling both standard and customized offerings.

Recurring Space Cadence Products are launched in space every month in GEO, MEO, and LEO, indicating ongoing R&D and manufacturing activity. This cadence aligns with growing satellite constellations, deep-space exploration missions, and governmental programs, suggesting predictable demand and long-term procurement opportunities.

Global Growth Channel Based in France with a history of international engagement (IMTS participation, past UK leadership hire), 3D PLUS demonstrates global market readiness. Sales opportunities exist with European and North American space firms, defense contractors, and systems integrators seeking compact, high-reliability modules.

Reliability Leadership The focus on high-reliability, high-performance, space-saving technology makes 3D PLUS well-positioned to win in defense, avionics, security, and critical infrastructure. Potential for cross-domain expansion into regulated markets that demand mission-critical electronics, backed by aerospace-grade heritage.